| Publication CODE |
Title |
| IEC 61191-6:2010 (2010-01) |
PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS in SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
249.00 €
|
76 P. |
Description
IEC 61191-6:2010 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board. This standard is applicable also to devices having joints made by melt and re-solidification, such as flip chip devices and multi-chip modules, in addition to BGA and LGA. This standard is not applicable to joints with under-fill between a device and a board, or to solder joints within a device package. This standard is applicable to macrovoids of the sizes of from 10 µm to several hundred micrometres generated in a soldered joint, but is not applicable to smaller voids (typically, planar microvoids) with a size of smaller than 10 µm in diameter. This standard is intended for evaluation purposes and is applicable to research studies, off-line production process control and reliability assessment of assembly.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
Available files
|
EN/FR version
|
EN/FR version
|
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| Registration |
105146 |
| ICS-Code (International Standards Classification) |
31.180
|
| NBN Status |
New |
|
| IEC publication date |
2010-01-14 |
| IEC stability date |
2023-12-31 |
| IEC last modification date |
2019-11-20 |
|
