| Publication CODE |
Title |
| IEC 61190-1-3:2007/AMD1:2010 (2010-06) |
AMENDMENT 1 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
42.00 €
|
17 P. |
Description
[Text at this stage is not available in English]
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2010-06-10 |
| Registration |
106520 |
| ICS-Code (International Standards Classification) |
31.190
|
| NBN Status |
New |
|
| IEC publication date |
2010-06-10 |
| IEC stability date |
2018-12-31 |
| IEC last modification date |
2017-12-13 |
|
