| Publication CODE |
Title |
| IEC 60068-2-83:2011 (2011-09) |
ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
249.00 €
|
76 P. |
Description
IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes.
NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2011-09-07 |
| Registration |
116686 |
| ICS-Code (International Standards Classification) |
19.040
, 31.190
|
| NBN Status |
New |
|
| IEC publication date |
2011-09-07 |
| IEC stability date |
2023-12-31 |
| IEC last modification date |
2020-02-27 |
|
