| Publication CODE |
Title |
| IEC 60068-2-58:1989 (1989-08) |
ENVIRONMENTAL TESTING. PART 2: TESTS. TEST TD: SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
25. |
Description
Determines solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices. The procedure uses a solder bath and applies only to products designed to withstand short-term immersion in molten solder.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
1989-08-15 |
| Registration |
156882 |
| ICS-Code (International Standards Classification) |
35.040
|
| NBN Status |
New |
|
| IEC publication date |
1989-08-15 |
| IEC last modification date |
2004-04-28 |
|
