| Publication CODE |
Title |
| IEC 60068-2-69:1995 (1995-12) |
ENVIRONMENTAL TESTING - PART 2: TESTS - TEST TE: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNT TECHNOLOGY BY THE WETTING BALANCE METHOD |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
159.00 €
|
43. |
Description
Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices.
The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
1995-12-08 |
| ICS-Code (International Standards Classification) |
35.040
|
| NBN Status |
New |
|
| IEC publication date |
1995-12-08 |
| IEC last modification date |
2007-05-09 |
|
