| Publication CODE |
Title |
| IEC PAS 62085:1998 (1998-12) |
IMPLEMENTATION OF BALL GRID ARRAY AND OTHER HIGH DENSITY TECHNOLOGY |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
366.00 €
|
88. |
Description
Establishes the requirements and interactions necessary for Printed Board Assembly processes for interconnecting high performance/high pin count I/C packages. Included is information on design principles, material selection, board fabrication, assembly technology, testing strategy, and reliability expectations based on end-use environments.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Withdrawn
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
1998-12-03 |
| ICS-Code (International Standards Classification) |
35.040
|
| NBN Status |
New |
|
| IEC publication date |
1998-12-03 |
| IEC last modification date |
2004-12-02 |
|
