| Publication CODE |
Title |
| IEC PAS 62084:1998 (1998-12) |
IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
398.00 €
|
105. |
Description
Describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include: design considerations, assembly processes, technology choices, application, and reliability data. Chip scale packaging variations include: flip chip, High Density Interconnect, Micro Ball Grid Array, Micro Surface Mount Technology and Slightly Larger than Integrated Circuit Carrier.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Withdrawn
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
1998-12-03 |
| ICS-Code (International Standards Classification) |
35.040
|
| NBN Status |
New |
|
| IEC publication date |
1998-12-03 |
| IEC last modification date |
2004-12-02 |
|
