| Publication CODE |
Title |
| IEC 60068-2-58:1999 (1999-01) |
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD - TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
122.00 €
|
17. |
Description
Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices.
The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
1999-01-15 |
| Registration |
156883 |
| ICS-Code (International Standards Classification) |
35.040
|
| NBN Status |
New |
|
| IEC publication date |
1999-01-15 |
| IEC last modification date |
2004-07-15 |
|
