| Publication CODE |
Title |
| IEC PAS 62293:2001 (2001-11) |
QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) LAYERS OR BOARDS (IPC 6016) |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
318.00 €
|
60. |
Description
Establishes the specific requirements for organic high-density interconnect layers with microvia technology as well as the quality and reliability assurance requirements that shall be met for their acquisition.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Withdrawn
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2001-11-28 |
| ICS-Code (International Standards Classification) |
35.040
|
| NBN Status |
New |
|
| IEC publication date |
2001-11-28 |
| IEC last modification date |
2004-12-02 |
|
