| Publication CODE |
Title |
| IEC 61190-1-2:2002 (2002-03) |
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDER PASTES FOR HIGH-QUALITY INTERCONNECTIONS in ELECTRONICS ASSEMBLY |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
122.00 €
|
35 P. |
Description
Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2002-03-22 |
| ICS-Code (International Standards Classification) |
35.040
|
| NBN Status |
New |
|
| IEC publication date |
2002-03-22 |
| IEC last modification date |
2007-04-26 |
|
