| Publication CODE |
Title |
| IEC 61189-3:1997+AMD1:1999 CSV (2006-11) |
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
731.00 €
|
141. |
Description
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods.
This consolidated version consists of the first edition (1997)
and its amendment 1 (1999). Therefore, no need to order amendment in
addition to this publication.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2006-11-27 |
| NBN Status |
New |
|
| IEC publication date |
2006-11-27 |
| IEC last modification date |
2011-01-10 |
|
