| Publication CODE |
Title |
| IEC TR 62866:2014 (2014-05) |
ELECTROCHEMICAL MIGRATION in PRINTED WIRING BOARDS AND ASSEMBLIES - MECHANISMS AND TESTING |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
398.00 €
|
187 P. |
Description
IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2014-05-07 |
| ICS-Code (International Standards Classification) |
31.180
|
| NBN Status |
New |
|
| IEC publication date |
2014-05-07 |
| IEC stability date |
2023-12-31 |
| IEC file modification date |
2014-05-06 |
| IEC last modification date |
2019-11-20 |
|
