| Publication CODE |
Title |
| IEC TR 60068-3-12:2014 (2014-10) |
ENVIRONMENTAL TESTING - PART 3-12: SUPPORTING DOCUMENTATION AND GUIDANCE - METHOD TO EVALUATE A POSSIBLE LEAD-FREE SOLDER REFLOW TEMPERATURE PROFILE |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
122.00 €
|
35 P. |
Description
IEC TR 60068-3-12:2014 presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. This process covers a great variety of electronic products, including a large range of package sizes (e.g. molded active electronic components, passive components and electromechanical components). Study A addresses requirements needed in the production of high-reliability electronic control units (ECU), as for example in automotive electronics. These requirements include measurement and production tolerances. Study B represents consumer electronics products and includes reflow oven capability, board design and package sizes. This edition includes the following significant technical changes with respect to the previous edition:
- the content has been adapted to the state-of-the-art of reflow-oven technology and termination finishes;
- minor language adjustments were performed.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2014-10-17 |
| ICS-Code (International Standards Classification) |
19.040
|
| NBN Status |
New |
|
| IEC publication date |
2014-10-17 |
| IEC stability date |
2023-12-31 |
| IEC file modification date |
2014-10-15 |
| IEC last modification date |
2019-11-20 |
|
