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Publication details

Publication CODE Title
IEC 61189-5-3:2015 (2015-01) TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
 
Price Excl. VAT Total number of pages, tables and drawings
249.00 € 79 P.
Description
IEC 61189-5-3:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering.

This publication is to be read in conjunction with IEC 61189-1:1997, IEC 61189-2:2006 and IEC 61189-3:2007.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Currently active
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2015-01-08
ICS-Code (International Standards Classification) 31.180
NBN Status New
IEC publication date 2015-01-08
IEC stability date 2022-12-31
IEC file modification date 2015-01-08
IEC last modification date 2017-11-15