| Publication CODE |
Title |
| IEC 61189-2-721:2015 (2015-04) |
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-721: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES - MEASUREMENT OF RELATIVE PERMITTIVITY AND LOSS TANGENT FOR COPPER CLAD LAMINATE AT MICROWAVE FREQUENCY USING A SPLIT POST DIELECTRIC RESONATOR |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
159.00 €
|
44 P.. |
Description
IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). IEC 61189-2-721:2015 is applicable to copper clad laminates and dielectric base materials.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2015-04-29 |
| ICS-Code (International Standards Classification) |
31.180
|
| NBN Status |
New |
|
| IEC publication date |
2015-04-29 |
| IEC stability date |
2023-12-31 |
| IEC file modification date |
2015-04-28 |
| IEC last modification date |
2019-11-20 |
|
