| Publication CODE |
Title |
| NBN EN IEC 63215-2:2023 (2023-12) |
ENDURANCE TEST METHODS FOR DIE ATTACH MATERIALS - PART 2: TEMPERATURE CYCLING TEST METHOD FOR DIE ATTACH MATERIALS APPLIED TO DISCRETE TYPE POWER ELECTRONIC DEVICES |
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| Price Excl. VAT |
Total number of pages, tables and drawings |
|
14.00 €
|
3. |
Description
IEC 63215-2:2023 applies to the die attach materials and joining system applied to discrete type power electronic devices.
This document specifies the temperature cycling test method which takes into account the actual usage conditions of discrete type power electronic devices to evaluate reliability of the die attach joint materials and joining system, and establishes a classification level for joining reliability (reliability performance index).
The test method specified in this document is not intended to evaluate power semiconductor devices themselves.
The test method specified in this document is not regarded as the one for use to guarantee the reliability of the power semiconductor device packages.
NOTE'The test result obtained using this document will not be used as absolute quantitative data, but for intercomparison with the other die attach materials results using the same setup.
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| Class |
C
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
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|
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| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
CLC/SR 91
Electronics assembly technology
|
| BEC Approval |
2023-11-28 |
| NBN Approval |
2023-12-06 |
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2023-11-28 |
| Date of announcement (d.o.a.) |
2024-02-28 |
| Date of publication (d.o.p.) |
2024-08-28 |
| Date of withdrawal former edition (d.o.w.) |
2026-11-28 |
| IEC file modification date |
2023-12-02 |
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