| Publication CODE |
Title |
| NBN EN IEC 61189-2-803:2023 (2023-09) |
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-803: TEST METHODS FOR Z-AXIS EXPANSION OF BASE MATERIALS AND PRINTED BOARDS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
14.00 €
|
3. |
Description
This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).
|
| Class |
C
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
|
|
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
CLC/SR 91
Electronics assembly technology
|
| BEC Approval |
2023-08-30 |
| NBN Approval |
2023-09-13 |
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2023-08-30 |
| Date of announcement (d.o.a.) |
2023-11-30 |
| Date of publication (d.o.p.) |
2024-05-30 |
| Date of withdrawal former edition (d.o.w.) |
2026-08-30 |
| IEC file modification date |
2023-09-09 |
|
