| Publication CODE |
Title |
| NBN EN 60068-2-54:2007 (2006-08) |
ENVIRONMENTAL TESTING
PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
25.00 €
|
3 P. |
Description
Outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. Provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
|
| Class |
C20
(ELECTRICAL MANUFACTURE - ELECTROTECHNICAL MATERIALS GENERAL)
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered here:
IEC 60068-2-54:2006.
For the series NBN EN 50XXX, the standards are however complete.
|
EN version
|
DE version
|
FR version
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2006-07-01 |
| NBN Approval |
2007-01-31 |
| Registration |
75404 |
| ICS-Code (International Standards Classification) |
19.040
, 31.020
|
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2006-07-01 |
| Date of availability (d.a.v.) |
2006-08-07 |
| Date of announcement (d.o.a.) |
2006-10-01 |
| Date of publication (d.o.p.) |
2007-04-01 |
| Date of withdrawal former edition (d.o.w.) |
2007-09-01 |
|
