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Publication details

Publication CODE Title
IEC PAS 62085:1998 (1998-12) IMPLEMENTATION OF BALL GRID ARRAY AND OTHER HIGH DENSITY TECHNOLOGY
 
Price Excl. VAT Total number of pages, tables and drawings
366.00 € 88.
Description
Establishes the requirements and interactions necessary for Printed Board Assembly processes for interconnecting high performance/high pin count I/C packages. Included is information on design principles, material selection, board fabrication, assembly technology, testing strategy, and reliability expectations based on end-use environments.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version

Status
Status IEC PUBLICATION
Situation Withdrawn
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 1998-12-03
ICS-Code (International Standards Classification) 35.040
NBN Status New
IEC publication date 1998-12-03
IEC last modification date 2004-12-02