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Publication details

Publication CODE Title
IEC 61189-2-721:2015 (2015-04) TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-721: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES - MEASUREMENT OF RELATIVE PERMITTIVITY AND LOSS TANGENT FOR COPPER CLAD LAMINATE AT MICROWAVE FREQUENCY USING A SPLIT POST DIELECTRIC RESONATOR
 
Price Excl. VAT Total number of pages, tables and drawings
159.00 € 44 P..
Description
IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). IEC 61189-2-721:2015 is applicable to copper clad laminates and dielectric base materials.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Currently active
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2015-04-29
ICS-Code (International Standards Classification) 31.180
NBN Status New
IEC publication date 2015-04-29
IEC stability date 2023-12-31
IEC file modification date 2015-04-28
IEC last modification date 2019-11-20