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Publication details

Publication CODE Title
IEC 60691:2002 (2002-12) THERMAL-LINKS - REQUIREMENTS AND APPLICATION GUIDE
 
Price Excl. VAT Total number of pages, tables and drawings
249.00 € 77.
Description
Applies to thermal-links, intended for incorporation in electrical appliances, electronic equipment and component parts thereof, normally intended for use indoors, in order to protect them against excessive temperatures under abnormal conditions. May be applicable to thermal-links for use under other than indoor conditions, provided that the climatic and other circumstances in the immediate surroundings of such thermal-links are comparable with those in this standard.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Withdrawn
Replaced by  IEC 60691:2015
Replaces  IEC 60691:1993
Replaces  IEC 60691:1993+AMD1:1995+AMD2:2000 CSV
Replaces  IEC 60691:1993/AMD1:1995
Replaces  IEC 60691:1993/AMD2:2000
Origin
Committee TC 32/SC 32C
MINIATURES FUSES
Responsible Monsieur DE LEEUW Thierry, Technical Officer
Diamant Building Bd Auguste Reyers, 80
1030  BRUXELLES
Phone: +32 2 706 85 72
E-mail: thierry.deleeuw@ceb-bec.be
Approval
BEC Approval 2002-12-19
ICS-Code (International Standards Classification) 29.120.50
IEC publication date 2002-12-19
IEC stability date 2014-12-31
IEC last modification date 2015-10-08