| Publication CODE |
Title |
| IEC 60749-19:2003/AMD1:2010 (2010-07) |
AMENDMENT 1 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 19: DIE SHEAR STRENGTH |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
11.00 €
|
4 P. |
Description
[Text at this stage is not available in English]
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2010-07-28 |
| Registration |
106862 |
| ICS-Code (International Standards Classification) |
31.080.01
|
| NBN Status |
New |
|
| IEC publication date |
2010-07-28 |
| IEC stability date |
2025-12-31 |
| IEC last modification date |
2018-11-22 |
|
