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Publication details

Publication CODE Title
IEC 60068-2-58:1999 (1999-01) ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD - TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
 
Price Excl. VAT Total number of pages, tables and drawings
122.00 € 17.
Description
Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version

Status
Status IEC PUBLICATION
Situation Withdrawn
Replaced by  IEC 60068-2-58:2004
Replaces  IEC 60068-2-58:1989
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 1999-01-15
Registration 156883
ICS-Code (International Standards Classification) 35.040
NBN Status New
IEC publication date 1999-01-15
IEC last modification date 2004-07-15