| Publication CODE |
Title |
| IEC 61189-2-808:2024 (2024-04) |
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-808: THERMAL RESISTANCE OF AN ASSEMBLY BY THERMAL TRANSIENT METHOD |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
122.00 €
|
40. |
Description
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2024-04-25 |
| ICS-Code (International Standards Classification) |
31.180
|
| NBN Status |
New |
|
| IEC publication date |
2024-04-25 |
| IEC stability date |
2028-12-31 |
| IEC file modification date |
2024-04-25 |
| IEC last modification date |
2024-04-25 |
|
