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Publication details

Publication CODE Title
IEC 60068-2-69:2017 (2017-03) ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
 
Price Excl. VAT Total number of pages, tables and drawings
318.00 € 110 P..
Description
IEC 60068-2-69:2017 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes.
The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.
This document provides the measurement procedures for solder alloys both with and without lead (Pb).
This edition includes the following significant technical changes with respect to the previous edition:
- integration of IEC 60068-2-54;
- inclusion of tests of printed boards;
- inclusion of new component types, and updating test parameters for the whole component list;
- inclusion of a new gauge R & R test protocol to ensure that the respective wetting balance equipment is correctly calibrated.
The contents of the corrigendum of January 2018 have been included in this copy.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Currently active
Replaces  IEC 60068-2-54:2006
Replaces  IEC 60068-2-69:2007
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2017-03-07
ICS-Code (International Standards Classification) 19.040 , 31.190
NBN Status New
IEC publication date 2017-03-07
IEC stability date 2026-12-31
IEC file modification date 2017-03-07
IEC last modification date 2019-06-19