| Publication CODE |
Title |
| NBN EN IEC 61189-2-804:2023 (2023-10) |
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-804: TEST METHODS FOR TIME TO DELAMINATION - T260, T288, T300 |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
14.00 €
|
3. |
Description
This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.
|
| Class |
C
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
|
|
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
CLC/SR 91
Electronics assembly technology
|
| BEC Approval |
2023-09-29 |
| NBN Approval |
2023-10-11 |
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2023-09-29 |
| Date of announcement (d.o.a.) |
2023-12-29 |
| Date of publication (d.o.p.) |
2024-06-29 |
| Date of withdrawal former edition (d.o.w.) |
2026-09-29 |
| IEC file modification date |
2023-10-07 |
|
