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Publication details

Publication CODE Title
IEC 62047-43:2024 (2024-03) SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 43: TEST METHOD OF ELECTRICAL CHARACTERISTICS AFTER CYCLIC BENDING DEFORMATION FOR FLEXIBLE MICRO-ELECTROMECHANICAL DEVICES
 
Price Excl. VAT Total number of pages, tables and drawings
122.00 € 18.
Description
IEC 62047-43:2024 specifies the test method of electrical characteristics after cyclic bending deformation for flexible electromechanical devices. These devices include passive micro components and active micro components on the flexible film or embedded in the flexible film. The desired in-plane dimensions of the device for the test method ranges typically from 1 mm to 300 mm and the thickness ranges from 10 'm to 1 mm, but these are not limiting values. The test method is so designed as to understand and further visualize the entire performance deterioration behaviour after cyclic bending deformation in a concept of 3D (P-S-N: Performance - Severity of bending - Number of cycles) plot over the loading space of severity of bending and number of repeated cycles. This document is essential to estimate safety margin over the operation period under a certain level of cyclic bending deformation and indispensable for reliable design of the product employing these devices.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version

Status
Status IEC PUBLICATION
Situation Currently active
Origin
Committee TC 47/SC 47F
MICRO-ELECTROMECHANICAL SYSTEMS
Responsible Ir DELENS Marc
Approval
BEC Approval 2024-03-19
ICS-Code (International Standards Classification) 31.080.99
NBN Status New
IEC publication date 2024-03-19
IEC stability date 2028-12-31
IEC file modification date 2024-03-19
IEC last modification date 2024-03-19