Publication CODE |
Title |
IEC 60191-6-13:2007 (2007-06) |
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-13: DESIGN GUIDELINE OF OPEN-TOP-TYPE SOCKETS FOR FINE-PITCH BALL GRID ARRAY AND FINE-PITCH LAND GRID ARRAY (FBGA/FLGA) |
|
Price Excl. VAT |
Total number of pages, tables and drawings |
85.00 €
|
29. |
Description
IEC 60191-6-13:2007 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.
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Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
Committee |
TC 47/SC 47D
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
|
Responsible |
Ir DELENS Marc
|
BEC Approval |
2007-06-27 |
ICS-Code (International Standards Classification) |
31.080.01
|
|
IEC publication date |
2007-06-27 |
IEC stability date |
2017-12-31 |
IEC last modification date |
2016-09-27 |
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