| Publication CODE |
Title |
| IEC 61190-1-3:2007+AMD1:2010 CSV (2010-11) |
ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
355.00 €
|
85 P. |
Description
IEC 61190-1-3:2007+A1:2010 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solder powders, etc.
This consolidated version consists of the second edition (2007)
and its amendment 1 (2010). Therefore, no need to order amendment in
addition to this publication.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2010-11-10 |
| Registration |
107721 |
| ICS-Code (International Standards Classification) |
31.190
|
| NBN Status |
New |
|
| IEC publication date |
2010-11-10 |
| IEC stability date |
2017-12-31 |
| IEC last modification date |
2017-12-13 |
|
