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Publication details

Publication CODE Title
IEC 61190-1-3:2007+AMD1:2010 CSV (2010-11) ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
 
Price Excl. VAT Total number of pages, tables and drawings
355.00 € 85 P.
Description
IEC 61190-1-3:2007+A1:2010 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solder powders, etc. This consolidated version consists of the second edition (2007) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Withdrawn
Replaced by  IEC 61190-1-3:2017
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2010-11-10
Registration 107721
ICS-Code (International Standards Classification) 31.190
NBN Status New
IEC publication date 2010-11-10
IEC stability date 2017-12-31
IEC last modification date 2017-12-13