Publication details
| Publication CODE |
Title |
| NBN EN IEC 61249-2-51:2023 (2023-06) |
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-51: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - BASE MATERIALS FOR INTEGRATED CIRCUIT CARD CARRIER TAPE, UNCLAD |
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| Price Excl. VAT |
Total number of pages, tables and drawings |
|
14.00 €
|
3. |
Description
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
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| Class |
C
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Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
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Status
| Status |
IEC PUBLICATION |
| Situation |
Currently active
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Origin
| Committee |
CLC/SR 91
Electronics assembly technology
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Approval
| BEC Approval |
2023-06-15 |
| NBN Approval |
2023-06-21 |
| NBN Status |
New |
|
| Date of ratification (d.o.r.) |
2023-06-15 |
| Date of announcement (d.o.a.) |
2023-09-15 |
| Date of publication (d.o.p.) |
2024-03-15 |
| Date of withdrawal former edition (d.o.w.) |
2026-06-15 |
| IEC file modification date |
2023-06-17 |
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