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Publication details

Publication CODE Title
IEC 60749-20:2002/COR1:2003 (2003-08) CORRIGENDUM 1 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC-ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
 
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Description
Modification of the validity date: now put at 2007.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version
 
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Status
Status IEC PUBLICATION
Situation Withdrawn
Replaced by  IEC 60749-20:2008
Origin
Committee TC 47
SEMICONDUCTOR DEVICES
Responsible Ir DELENS Marc
Approval
BEC Approval 2003-08-13
ICS-Code (International Standards Classification) 35.080
NBN Status New
IEC publication date 2003-08-13
IEC last modification date 2008-12-09