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Publication details

Publication CODE Title
NBN EN IEC 61188-6-1:2021 (2021-04) CIRCUIT BOARDS AND CIRCUIT BOARD ASSEMBLIES - DESIGN AND USE - PART 6-1: LAND PATTERN DESIGN - GENERIC REQUIREMENTS FOR LAND PATTERN ON CIRCUIT BOARDS
 
Price Excl. VAT Total number of pages, tables and drawings
14.00 € 3.
Description
IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
Class  C
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally only available in English or French. Only the cover page is translated and the document itself is in English or in French.

EN version
FR version
Status
Status IEC PUBLICATION
Situation Currently active
Replaces  NBN EN 61188-5-1:2002
Origin
Committee CLC/SR 91
Electronics assembly technology
Approval
NBN Approval 2021-04-08
NBN Status New
Date of announcement (d.o.a.) 2021-06-30
IEC file modification date 2021-04-03