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Publication details

Publication CODE Title
IEC 60749-3:2002 (2002-04) SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL INSPECTION
 
Price Excl. VAT Total number of pages, tables and drawings
11.00 € 7.
Description
Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The contents of the corrigendum of August 2003 have been included in this copy.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Withdrawn
Replaced by  IEC 60749-3:2017
Partly replaces  IEC 60749:1996
Partly replaces  IEC 60749:1996+AMD1:2000+AMD2:2001 CSV
Partly replaces  IEC 60749:1996/AMD1:2000
Partly replaces  IEC 60749:1996/AMD2:2001
Replaces  IEC PAS 62163:2000
Origin
Committee TC 47
SEMICONDUCTOR DEVICES
Responsible Ir DELENS Marc
Approval
BEC Approval 2002-04-09
ICS-Code (International Standards Classification) 31.080.01
IEC publication date 2002-04-09
IEC stability date 2016-12-31
IEC last modification date 2017-03-03