| Publication CODE |
Title |
| IEC 61188-5-6:2003 (2003-01) |
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-6: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
122.00 €
|
37. |
Description
Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2003-01-23 |
| ICS-Code (International Standards Classification) |
31.190
|
|
| IEC publication date |
2003-01-23 |
| IEC stability date |
2020-12-31 |
| IEC last modification date |
2017-11-15 |
|
