Account:  - Login  |  Webstore  |  Shopping basket cart
English  |  Français  |  Nederlands

Publication details

Publication CODE Title
IEC TR 62258-3:2010 (2010-08) SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE in HANDLING, PACKING AND STORAGE
 
Price Excl. VAT Total number of pages, tables and drawings
318.00 € 109 P.
Description
IEC/TR 62258-3:2010 has been developed to facilitate the production, supply and use of semiconductor die products, including:
- wafers,
- singulated bare die,
- die and wafers with attached connection structures,
- and minimally or partially encapsulated die and wafers. This report contains suggested good practice for the handling, packing and storage of die products. Success in manufacture of electronic assemblies containing die products is enhanced by attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly. This edition includes the following significant technical changes with respect to the previous edition.
1. Special requirements have been added throughout the document for optical die, where applicable. For example see 4.3 paragraph 4 and 10.1.3 paragraph 3.
2. The following new subclauses have been added:
- 4.4.6 ESD Guidelines
- 5.1 Wafer thinning
3. Subclause 5.2 (Singulation or die separation) has been renamed from the previous Subclause 5.1 (Wafer sawing) and has been expanded to included other methods of singulation or sawing, including:
- 5.2.2 Wafer scribing
- 5.2.3 Laser cutting
- 5.2.4 Dice before grind (DBG)
4. Subclause 5.3.7 (previous edition Subclause 5.2.7) has been changed to include optical and microwave die.
5. In Subclause 6.3, the Subclause 6.3.2 (Specialised wafer tubs) has been added to include wafer taubs specially handle and ship wafers that have not been singulated.
6. Two new Subclauses have been to Clause 6:
- 6.9 Handling and packing of thinned die or wafers
- 6.10 Packing materials and their reuse
7. A new subclause has been added to Subclause 9.6:
- 9.6.3 Use of packing material having sacrificial properties
8. Annex A (Planning checklist) has been updated throughout.
9. In Annex B (Material specifications) a new Subclause has been added:
- B.5 Adhesive gel tray material specifications.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status TECHNICAL REPORT
Situation Currently active
Replaces  IEC TR 62258-3:2005
Origin
Committee TC 47
SEMICONDUCTOR DEVICES
Responsible Ir DELENS Marc
Approval
BEC Approval 2010-08-06
Registration 106974
ICS-Code (International Standards Classification) 31.080.99
NBN Status New
IEC publication date 2010-08-06
IEC stability date 2026-12-31
IEC last modification date 2019-11-20