| Publication CODE |
Title |
| IEC 60749-25:2003 (2003-07) |
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
85.00 €
|
25. |
Description
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.
Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2003-07-11 |
| ICS-Code (International Standards Classification) |
31.080.01
|
|
| IEC publication date |
2003-07-11 |
| IEC stability date |
2025-12-31 |
| IEC last modification date |
2018-01-11 |
|
