| Publication CODE |
Title |
| IEC 62258-6:2006 (2006-08) |
SEMICONDUCTOR DIE PRODUCTS - PART 6: REQUIREMENTS FOR INFORMATION CONCERNING THERMAL SIMULATION |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
42.00 €
|
9. |
Description
Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Currently active
|
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2006-08-28 |
| ICS-Code (International Standards Classification) |
31.080.99
|
|
| IEC publication date |
2006-08-28 |
| IEC stability date |
2026-12-31 |
| IEC last modification date |
2019-11-20 |
|
