| Publication CODE |
Title |
| IEC PAS 62173:2000 (2000-08) |
SOLDERABILITY TEST METHOD |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
122.00 €
|
17. |
Description
Provides a means of determining the solderability of device package terminations that are intended to be joined to another surface using solder for the attachment.
Provides also optional conditions for ageing and soldering for the purpose of allowing simulation of the soldering process to be used in the device application.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Status |
IEC PUBLICATION |
| Situation |
Withdrawn
|
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2000-08-22 |
| ICS-Code (International Standards Classification) |
35.040
|
| NBN Status |
New |
|
| IEC publication date |
2000-08-22 |
| IEC last modification date |
2004-03-15 |
|
