| Publication CODE |
Title |
| IEC PAS 62647-23:2011 (2011-07) |
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
286.00 €
|
138 P. |
Description
IEC/PAS 62647-23:2011(E) provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface finishes.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 107
PROCESS MANAGEMENT FOR AVIONICS
|
| BEC Approval |
2011-07-28 |
| Registration |
116490 |
| ICS-Code (International Standards Classification) |
35.040
|
| NBN Status |
New |
|
| IEC publication date |
2011-07-28 |
| IEC stability date |
2014-12-31 |
| IEC last modification date |
2013-10-07 |
|
