| Publication CODE |
Title |
| IEC 61760-3:2021 (2021-02) |
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH-HOLE REFLOW (THR) SOLDERING |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
201.00 €
|
57. |
Description
IEC 61760-3:2021 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology.
The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need to be part of any component generic, sectional or detail specification, when through-hole reflow soldering is intended.
Furthermore, this document provides component users and manufacturers with a reference set of typical process conditions used in through-hole reflow soldering technology.
This edition includes the following significant technical changes with respect to the previous edition:
a) change position tolerance requirement (0,4 mm maximum to between 0,2 mm and 0,4 mm);
b) introduce through-hole vacant method as a solder paste supply method.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
|
| Responsible |
De heer VAN HECKE Luk
|
| BEC Approval |
2021-02-03 |
| ICS-Code (International Standards Classification) |
31.190
|
| NBN Status |
New |
|
| IEC publication date |
2021-02-03 |
| IEC stability date |
2026-12-31 |
| IEC file modification date |
2021-02-03 |
| IEC last modification date |
2021-02-03 |
|
