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Publication details

Publication CODE Title
IEC 60749-3:2017 (2017-03) SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 3: EXTERNAL VISUAL EXAMINATION
 
Price Excl. VAT Total number of pages, tables and drawings
42.00 € 11 P..
Description
IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
This edition includes the following significant technical changes with respect to the previous edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version

Status
Status IEC PUBLICATION
Situation Currently active
Replaces  IEC 60749-3:2002
Replaces  IEC 60749-3:2002/COR1:2003
Origin
Committee TC 47
SEMICONDUCTOR DEVICES
Responsible Ir DELENS Marc
Approval
BEC Approval 2017-03-03
ICS-Code (International Standards Classification) 31.080.01
NBN Status New
IEC publication date 2017-03-03
IEC stability date 2022-12-31
IEC file modification date 2017-03-03
IEC last modification date 2019-08-29