Publication CODE |
Title |
NBN EN IEC 61188-6-1:2021 (2021-04) |
CIRCUIT BOARDS AND CIRCUIT BOARD ASSEMBLIES - DESIGN AND USE - PART 6-1: LAND PATTERN DESIGN - GENERIC REQUIREMENTS FOR LAND PATTERN ON CIRCUIT BOARDS |
|
Price Excl. VAT |
Total number of pages, tables and drawings |
14.00 €
|
3. |
Description
IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
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Class |
C
|
Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
|
|
Committee |
CLC/SR 91
Electronics assembly technology
|
NBN Approval |
2021-04-08 |
NBN Status |
New |
|
Date of announcement (d.o.a.) |
2021-06-30 |
IEC file modification date |
2021-04-03 |
|