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Publication details

Publication CODE Title
IEC 61189-2-808:2024 (2024-04) TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2-808: THERMAL RESISTANCE OF AN ASSEMBLY BY THERMAL TRANSIENT METHOD
 
Price Excl. VAT Total number of pages, tables and drawings
122.00 € 40.
Description
IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

Status
Status IEC PUBLICATION
Situation Currently active
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2024-04-25
ICS-Code (International Standards Classification) 31.180
NBN Status New
IEC publication date 2024-04-25
IEC stability date 2028-12-31
IEC file modification date 2024-04-25
IEC last modification date 2024-04-25