Account:  - Login  |  Webstore  |  Shopping basket cart
English  |  Français  |  Nederlands

Publication details

Publication CODE Title
IEC 62878-1:2019 (2019-10) DEVICE EMBEDDING ASSEMBLY TECHNOLOGY - PART 1: GENERIC SPECIFICATION FOR DEVICE EMBEDDED SUBSTRATES
 
Price Excl. VAT Total number of pages, tables and drawings
122.00 € 19.
Description
IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN version

Status
Status IEC PUBLICATION
Situation Currently active
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2019-10-14
ICS-Code (International Standards Classification) 31.180 , 31.190
NBN Status New
IEC publication date 2019-10-14
IEC stability date 2025-12-31
IEC file modification date 2019-10-14
IEC last modification date 2020-03-11