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Publication details

Publication CODE Title
IEC 62137:2004 (2004-07) ENVIRONMENTAL AND ENDURANCE TESTING - TEST METHODS FOR SURFACE-MOUNT BOARDS OF AREA ARRAY TYPE PACKAGES FBGA, BGA, FLGA, LGA, SON AND QFN
 
Price Excl. VAT Total number of pages, tables and drawings
201.00 € 57.
Description
This International Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. This standard tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits (hereinafter both referred to as semiconductor devices) used mainly for industrial and consumer use equipment.
Class  C990  (IEC PUBLICATIONS IEC PUBLICATIONS)
Available files
EN/FR version

EN version

Status
Status IEC PUBLICATION
Situation Withdrawn
Replaced by  IEC 62137-4:2014
Origin
Committee TC 91
ELECTRONICS ASSEMBLY TECHNOLOGY
Responsible De heer VAN HECKE Luk
Approval
BEC Approval 2004-07-14
ICS-Code (International Standards Classification) 31.120
IEC publication date 2004-07-06
IEC stability date 2013-12-31
IEC last modification date 2014-10-09