| Publication CODE |
Title |
| IEC 60749-20:2002/COR1:2003 (2003-08) |
CORRIGENDUM 1 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC-ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
0.00 €
|
0. |
Description
Modification of the validity date: now put at 2007.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
Available files
|
|
|
ATTENTION: With some browsers, you may experience problems if you open the downloaded file directly. If you experience this problem, please first save the file locally and then open it |
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2003-08-13 |
| ICS-Code (International Standards Classification) |
35.080
|
| NBN Status |
New |
|
| IEC publication date |
2003-08-13 |
| IEC last modification date |
2008-12-09 |
|
