Publication CODE |
Title |
NBN EN 60749-9:2017 (2017-06) |
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 9: PERMANENCE OF MARKING |
|
Price Excl. VAT |
Total number of pages, tables and drawings |
25.00 €
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2. |
Description
IEC 60749-9:2017(E) is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process.
This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test.
This edition includes the following significant technical changes with respect to the previous edition:
a) revision to Clause 4 Equipment by a complete rewriting of Clause 3 Terms and definitions;
b) additional variant – ‘adhesive tape pull test’.
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Class |
C
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Available files
ATTENTION: Belgian registered standards (NBN EN or NBN HD) are generally
only available in English or French. Only the cover page is translated
and the document itself is in English or in French.
Very important notice: 98% of the text of the NBN EN 55XXX,
NBN EN 6XXXX comes from the IEC text which is NOT included.
This text can be ordered here:
IEC 60749-9:2017.
For the series NBN EN 50XXX, the standards are however complete.
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DE version
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EN version
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FR version
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Status |
Registered trilingual Belgian standard EN or FR or DE |
Situation |
Currently active
Replaces
NBN EN 60749-9:2002
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Committee |
TC 47
SEMICONDUCTOR DEVICES
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Responsible |
Ir DELENS Marc
|
BEC Approval |
2017-04-07 |
NBN Approval |
2017-07-19 |
Registration |
176713 |
ICS-Code (International Standards Classification) |
31.080.01
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NBN Status |
New |
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Date of ratification (d.o.r.) |
2017-04-07 |
Date of availability (d.a.v.) |
2017-06-16 |
Date of announcement (d.o.a.) |
2017-07-07 |
Date of publication (d.o.p.) |
2018-01-07 |
Date of withdrawal former edition (d.o.w.) |
2020-04-07 |
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