Publication CODE |
Title |
IEC 60191-6-12:2011 (2011-06) |
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-12: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDELINES FOR FINE-PITCH LAND GRID ARRAY (FLGA) |
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Price Excl. VAT |
Total number of pages, tables and drawings |
122.00 €
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37 P. |
Description
IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition:
- scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: "Rectangular type" has been deleted from the title;
- ball pitch of 0,3 mm has been added;
- datum is changed from the body datum to the ball datum;
- combination lists of D, E, MD, and ME have been revised.
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Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
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Committee |
TC 47/SC 47D
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES
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Responsible |
Ir DELENS Marc
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BEC Approval |
2011-06-08 |
Registration |
116207 |
ICS-Code (International Standards Classification) |
31.080.01
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NBN Status |
New |
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IEC publication date |
2011-06-08 |
IEC stability date |
2021-12-31 |
IEC last modification date |
2019-01-10 |
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