| Publication CODE |
Title |
| IEC 60749-20:2002 (2002-09) |
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC-ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
159.00 €
|
49. |
Description
Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.
The contents of the corrigendum of August 2003 have been included in this copy.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2002-09-30 |
| ICS-Code (International Standards Classification) |
35.040
|
|
| IEC publication date |
2002-09-30 |
| IEC last modification date |
2008-12-09 |
|
