| Publication CODE |
Title |
| IEC 60749-21:2004 (2004-03) |
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY |
| |
| Price Excl. VAT |
Total number of pages, tables and drawings |
|
159.00 €
|
45. |
Description
Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.
|
| Class |
C990
(IEC PUBLICATIONS IEC PUBLICATIONS)
|
| Committee |
TC 47
SEMICONDUCTOR DEVICES
|
| Responsible |
Ir DELENS Marc
|
| BEC Approval |
2004-03-17 |
| ICS-Code (International Standards Classification) |
31.080.01
|
|
| IEC publication date |
2004-03-15 |
| IEC last modification date |
2011-04-07 |
|
